Qualcomm will provide reasonable accommodations, upon request, to support individuals with disabilities to be able participate in the hiring process. + Continuous communication which includes the comprehension of information with colleagues, customers, and vendors both in person and remotely.īachelors – Engineering, Bachelors – ScienceĢ+ years ASIC design, verification, or related work experience.ĭoctorate – Applied Physics, Doctorate – Electrical Engineering, Doctorate – Mechanical Engineering, Masters – Applied Physics, Masters – Electrical Engineering, Masters – Mechanical EngineeringĪNSYS Icepak, ANSYS Mechanical, Flotherm, Semiconductor Physics, Thermal TestingĪpplicants: If you are an individual with a disability and need an accommodation during the application/hiring process, please call Qualcomm’s toll-free number found here () for assistance. + Monitors and utilizes computers and test equipment for more than 6 hours a day. + Performs required tasks at various heights (e.g., standing or sitting). + Frequently transports and installs equipment up to 5 lbs. + Frequently transports between offices, buildings, and campuses up to ½ mile. + Experience operating thermal measurement equipment such as IR camera, thermal couple, etc. + Some experience with CAD tools such as Solidworks, AutoCAD + Ability to design thermal tests and execute per plan within a laboratory environment. + Experience with design based simulation. + Expertise in conducting CFD simulations utilizing tools such as ANSYS-Icepak or Flotherm. + Design experience with PCB, component placement, enclosures, and heat sinks. + Through understanding of JEDEC/IPC thermal related standards/specifications. + Good knowledge of semiconductor device physics and thermal issues. + In-depth understanding of natural and forced convection cooling relating to consumer electronics. + Thorough understanding of cooling techniques for electronic components and equipment. + Knowledge of Radio Frequency (RF) Fundamentals + 3+ years of semiconductor industry experience in Thermal Engineering/Sciences. + Research on the industry trend and leading technology in thermal simulation. + Conduct test or research on thermal materials and thermal solutions. + Manage technical projects across organization. + Perform thermal simulations to support device level, package level and system-level modeling. + Design, set up, and execute experiments followed by delivering/presenting results for various thermal or mechanical experiments. + Perform thermal simulations utilizing CFD/FEA tools for package and product-level solutions and present results. + Support thermal/mechanical projects from concept to production phase. Advanced knowledge of semiconductor device level thermal problems, and system level thermal solution/simulation is required. Such individual should have in-depth understanding of heat transfer fundamentals in addition to expertise in thermal modeling utilizing CFD/FEA tools. The qualified candidate will be part of a larger simulation team contributing to innovative solutions to complex thermal management, mechanical reliability problems in our heterogenous system in package products. QCT RFFE Engineering Team is seeking a talented Thermal Engineer to contribute to continued success of our industry-leading portfolio of RF frond end solutions. This is the Invention Age – and this is where you come in. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. Job Area:Engineering Group, Engineering Group > ASICS Engineering
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